Legrand expands OCP data centre kit for AI workloads

Legrand has expanded its Open Compute Project-aligned data centre infrastructure portfolio with rack, power, management and cooling products for AI and high-density computing environments.

The updated range includes ORv3-compliant rack and power equipment, a Smart Rack Controller and a new 48VDC-ready Rear Door Heat Exchanger. These products are designed to fit Open Compute Project architectures, which are increasingly used in large-scale data centre deployments.

Demand from AI and high-performance computing workloads has prompted operators to rethink how they build and run data halls. Higher rack densities and changing thermal requirements have increased interest in architectures that simplify integration and reduce power conversion steps.

Legrand's portfolio includes a 33kW power shelf with Xerus firmware, a vertical 48VDC busbar in 400, 700 and 1400A configurations, and an ORv3 rack rated to support loads of up to 2,300kg. The Smart Rack Controller, known as SRC2, is designed to integrate with the ORv3 48VDC busbar and provide rack-level environmental monitoring and sensor management.

The new cooling product, a 48VDC-ready Rear Door Heat Exchanger, or RDHx, connects directly to the rack's DC busbar. According to Legrand, this reduces the need for extra conversion stages in the electrical path and can simplify deployment in ORv3-based environments.

Open standards

The move reflects wider industry support for open hardware standards in data centres, particularly among operators seeking greater consistency across equipment from different suppliers. Open Compute Project specifications have gained traction in hyperscale and cloud environments, and vendors have increasingly adapted racks, power systems and thermal management products to align with those designs.

Legrand says its range is intended to support white-space architecture while allowing operators to scale deployments as power and cooling demands rise. In data centre design, white space refers to the area housing IT equipment and related infrastructure, making rack form factor, power distribution and cooling design central to expansion plans.

It also highlighted its recent move to Platinum membership within the Open Compute Project, placing it among companies seeking a larger role in shaping and supporting open standards for data centre hardware.

Marc Marazzi, Vice President, Legrand Data Centre Solutions Europe, said the expanded line-up is intended to help customers adopt open architectures while managing rising density requirements.

"By embracing open architectures, Legrand is helping customers move beyond traditional vendor constraints and deploy infrastructure designed for adaptability, efficiency, and long-term growth," said Marc Marazzi, Vice President, Legrand Data Centre Solutions Europe.

"Our OCP-aligned portfolio integrates seamlessly with our broader ecosystem of power distribution, intelligent rack management, and cooling technologies to support increasing density requirements. Our recent transition to Platinum membership within the Open Compute Project further demonstrates our commitment to open innovation and active collaboration with the OCP community as organizations scale for AI and high-performance computing workloads," Marazzi added.

Density pressures

The announcement comes as suppliers across the data centre market respond to the operational demands of AI systems, which often require more electricity and more intensive cooling than conventional enterprise workloads. Rear-door heat exchangers have attracted renewed attention because they can remove heat close to the source and avoid some of the complexity of room-level changes.

Direct current distribution has also become more prominent in Open Compute Project designs. Supporters argue that using 48VDC distribution within racks can reduce inefficiencies associated with multiple conversion stages, while helping standardise how power is delivered to IT equipment and supporting infrastructure.

Legrand operates in the electrical and digital building infrastructure market and has built its data centre portfolio through brands including Minkels, Raritan, Server Technology, Starline and USystems. The broader group reported sales of €9.5 billion in 2025.

The latest additions are intended to give operators a more complete set of components for AI-scale deployments, spanning power distribution, rack-level management and thermal control within Open Compute Project environments.